frequency multiplier - active - chip 1 HMC1110 v00.0615 ga a s mmic x6 active frequency multiplier, 71 - 86 ghz functional diagram features typical applications general description parameter min. typ. max. units frequency range, input 11.83 - 14.33 ghz frequency range, output 71 - 86 ghz input power drive 0 - 6 dbm output power 10 13 dbm 5fo harmonic isolation (with respect to the output signal level) 25 dbc 7fo harmonic isolation (with respect to the output signal level) 4 0 db c input return loss 15 db output return loss 12 db supply current (vd_amp1 + vd_amp2) [1] 175 ma supply current (vd_mult) [2] 80 ma the HMC1110 is ideal for: ? point-to-point & vsat radios ? test instrumentation ? military & space ? sensors the HMC1110 is a x6 active broadband frequency multiplier chip utilizing gaas phemt technology. when driven by a +4 dbm signal, the multiplier provides +13 dbm typical output power from 71 to 86 ghz. the 5fo and 7fo harmonic isolations with respect to the output signal level are +25 dbc and +40 dbc respectively. the HMC1110 is ideal for use in lo multiplier chains for pt-to-pt & vsat radios yielding reduced parts count by integrating input and output amplifers vs. traditional approach which uses discrete components. all data is taken with the chip connected via two 0.025mm (1 mil) wire bonds of minimal length 0.31 mm (12 mils). high output power: +13 dbm low input power drive: 0 to +6 dbm 5fo harmonic isolation: +25 dbc 7fo harmonic isolation: +40 dbc die size: 2.44 x 1.35 x 0.1 mm electrical specifcations, t a = +25 c, vd_amp1 = vd_amp2 = 4v, vd_mult = 1.5v, 4 dbm drive level [1] [2] [1] adjust vg_amp between -2 to 0v to achieve 175 ma total on vd_amp1 and vd_amp2. [2] adjust vg_x2, vg_x3 between -2 to 0v to achieve 1 - 2 ma on vd_mult. for price, delivery and to place orders: hittite microwave corporation, 2 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com information furn is hed by an al og devices is believed to be a cc urate and re lia bl e. however, no responsibility is assumed by an al og devices for its u se, no r for any infring emen ts of pat en ts or other rights of third parties that may result from its use. specifications subject to change without notice. no license is granted by implication or otherwise under any patent or patent rights of analog devices. trademarks and registered trademarks are the property of their respective owners. for price, delivery, and to place o rd ers: an al og devices, inc., one techn ol ogy way, p.o. box 9106, norwood, ma 02062-9106 phone: 781-329-4700 o rd er online at ww w.an alog .com app li cation sup po rt: p ho ne: 1-800-analog-d
frequency multiplier - active - chip 2 HMC1110 v00.0615 ga a s mmic x6 active frequency multiplier, 71 - 86 ghz output power vs. vd_amp supply current, vd_amp = +4v [1] output power vs. drive level -10 -5 0 5 10 15 20 70 72 74 76 78 80 82 84 86 88 +25c +85c -55c output power (dbm) output frequency (ghz) -10 -5 0 5 10 15 20 70 72 74 76 78 80 82 84 86 88 0dbm 2dbm 4dbm 6dbm 8dbm output power (dbm) output frequency (ghz) output power vs. vd_mult supply voltage, vd_amp = +4v [1] -10 -5 0 5 10 15 20 70 72 74 76 78 80 82 84 86 88 150 ma 175 ma 200 ma output power (dbm) output frequency (ghz) -10 -5 0 5 10 15 20 70 72 74 76 78 80 82 84 86 88 150 ma 175 ma 200 ma output power (dbm) output frequency (ghz) output power vs. vd_amp supply current, vd_amp = +3v [1] -10 -5 0 5 10 15 20 70 72 74 76 78 80 82 84 86 88 1.5 v 2 v 2.5 v output power (dbm) output frequency (ghz) output power vs. vd_mult supply voltage, vd_amp = +3v [1] -10 -5 0 5 10 15 20 70 72 74 76 78 80 82 84 86 88 1.5 v 2 v 2.5 v output power (dbm) output frequency (ghz) [1] drive level = +4 dbm output power vs. temperature [1] for price, delivery and to place orders: hittite microwave corporation, 2 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com information furn is hed by an al og devices is believed to be a cc urate and re lia bl e. however, no responsibility is assumed by an al og devices for its u se, no r for any infring emen ts of pat en ts or other rights of third parties that may result from its use. specifications subject to change without notice. no license is granted by implication or otherwise under any patent or patent rights of analog devices. trademarks and registered trademarks are the property of their respective owners. for price, delivery, and to place o rd ers: an al og devices, inc., one techn ol ogy way, p.o. box 9106, norwood, ma 02062-9106 phone: 781-329-4700 o rd er online at ww w.an alog .com app li cation sup po rt: p ho ne: 1-800-analog-d
frequency multiplier - active - chip 3 HMC1110 v00.0615 ga a s mmic x6 active frequency multiplier, 71 - 86 ghz input return loss output return loss, rf input = 12.5 ghz -25 -20 -15 -10 -5 0 10 11 12 13 14 15 16 input return loss (db) frequency (ghz) -20 -16 -12 -8 -4 0 70 72 74 76 78 80 82 84 86 output return loss (db) frequency (ghz) dc power vs. temperature, pin = 4dbm vd_mult = +1.5v, vd_amp = +4v 0 0.2 0.4 0.6 0.8 1 1.2 1.4 70 72 74 76 78 80 82 84 86 88 +25c +85c -55c total dc power (w) output frequency (ghz) 5th harmonic isolation vs. vd_mult pin = 4dbm, vd_amp = +4v 5th & 7th harmonic isolation, pin = 4dbm vd_mult = +1.5v, vd_amp = +4v 10 15 20 25 30 35 40 45 11.8 12.2 12.6 13 13.4 13.8 14.2 14.6 1.5v 2v 2.5v isolation (dbc) input frequency (ghz) 10 20 30 40 50 60 11.8 12.2 12.6 13 13.4 13.8 14.2 14.6 5fo 7fo isolation (dbc) input frequency (ghz) for price, delivery and to place orders: hittite microwave corporation, 2 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com information furn is hed by an al og devices is believed to be a cc urate and re lia bl e. however, no responsibility is assumed by an al og devices for its u se, no r for any infring emen ts of pat en ts or other rights of third parties that may result from its use. specifications subject to change without notice. no license is granted by implication or otherwise under any patent or patent rights of analog devices. trademarks and registered trademarks are the property of their respective owners. for price, delivery, and to place o rd ers: an al og devices, inc., one techn ol ogy way, p.o. box 9106, norwood, ma 02062-9106 phone: 781-329-4700 o rd er online at ww w.an alog .com app li cation sup po rt: p ho ne: 1-800-analog-d
frequency multiplier - active - chip 4 HMC1110 v00.0615 ga a s mmic x6 active frequency multiplier, 71 - 86 ghz outline drawing notes: 1. all dimensions are in inches [mm] 2. die thickness is .004 3. typical bond pad is 0.0051 [3.303] square 4. backside metallization: gold 5. bond pad metallization: gold 6. backside metal is ground. 7. connection not required for unlabeled bond pads. 8. overall die size .002 electrostatic sensitive device observe handling precautions absolute maximum ratings amplifer drain bias voltage (vd_amp) +4.5 v multiplier drain bias voltage (vd_ mult ) +3v rf input power +10 dbm junction temperature 146 c channel temperature 175 c continuous pdiss (t=85 c) (derate=17.21 mw/ c above 85c) 1.55 w thermal resistance (r th ) (junction to die bottom) 58.1 c/ w operating temperature -55 c to +85 c storage temperature -65 c to 150 c esd sensitivity (hbm) class 0, passed 150v die packaging information [1] standard alternate gp-2 (gel pack) [2] [1] refer to the packaging information section for die packaging dimensions. [2] for alternate packaging information contact hittite microwave corporation. for price, delivery and to place orders: hittite microwave corporation, 2 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com information furn is hed by an al og devices is believed to be a cc urate and re lia bl e. however, no responsibility is assumed by an al og devices for its u se, no r for any infring emen ts of pat en ts or other rights of third parties that may result from its use. specifications subject to change without notice. no license is granted by implication or otherwise under any patent or patent rights of analog devices. trademarks and registered trademarks are the property of their respective owners. for price, delivery, and to place o rd ers: an al og devices, inc., one techn ol ogy way, p.o. box 9106, norwood, ma 02062-9106 phone: 781-329-4700 o rd er online at ww w.an alog .com app li cation sup po rt: p ho ne: 1-800-analog-d
frequency multiplier - active - chip 5 HMC1110 v00.0615 ga a s mmic x6 active frequency multiplier, 71 - 86 ghz pad descriptions pad number function description pin schematic 1, 3, 4, 6, 8, 10, 12, 13, 15, 17, 18 gnd ground pads must be connected to rf/dc ground. 2 lo_in this pin is dc coupled and matched to 50 ohms. 5 vd_ mult supply voltage for multiplier. external bypass capacitors of 100 pf, 0.01 f and 4.7 f are recommended. 7, 11 vd_amp1, vd_amp2 supply voltage for input and output amplifers. external bypass capacitors of 100 pf, 0.01f and 4.7 f are recommended. 9 v g_amp gate control for amplifer. external bypass capacitors of 100pf, 0.01f and 4.7f are required. adjust vg_amp between -2 to 0v to achieve 175 ma total on vd_amp1 and vd_amp2. 16, 19 vg_x2, vg_x3 gate control for multiplier. external bypass capacitors of 100 pf, 0.01 f and 4.7 f are recommended. adjust vg_x2, vg_x3 between -2 to 0v to achieve 1 - 2 ma on vd_mult. 14 lo_out this pin is ac coupled and matched to 50 ohms. die bottom gnd die bottom must be connected to rf/dc ground. for price, delivery and to place orders: hittite microwave corporation, 2 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com information furn is hed by an al og devices is believed to be a cc urate and re lia bl e. however, no responsibility is assumed by an al og devices for its u se, no r for any infring emen ts of pat en ts or other rights of third parties that may result from its use. specifications subject to change without notice. no license is granted by implication or otherwise under any patent or patent rights of analog devices. trademarks and registered trademarks are the property of their respective owners. for price, delivery, and to place o rd ers: an al og devices, inc., one techn ol ogy way, p.o. box 9106, norwood, ma 02062-9106 phone: 781-329-4700 o rd er online at ww w.an alog .com app li cation sup po rt: p ho ne: 1-800-analog-d
frequency multiplier - active - chip 6 HMC1110 v00.0615 ga a s mmic x6 active frequency multiplier, 71 - 86 ghz assembly diagram for price, delivery and to place orders: hittite microwave corporation, 2 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com information furn is hed by an al og devices is believed to be a cc urate and re lia bl e. however, no responsibility is assumed by an al og devices for its u se, no r for any infring emen ts of pat en ts or other rights of third parties that may result from its use. specifications subject to change without notice. no license is granted by implication or otherwise under any patent or patent rights of analog devices. trademarks and registered trademarks are the property of their respective owners. for price, delivery, and to place o rd ers: an al og devices, inc., one techn ol ogy way, p.o. box 9106, norwood, ma 02062-9106 phone: 781-329-4700 o rd er online at ww w.an alog .com app li cation sup po rt: p ho ne: 1-800-analog-d
frequency multiplier - active - chip 7 HMC1110 v00.0615 ga a s mmic x6 active frequency multiplier, 71 - 86 ghz mounting & bonding techniques for millimeterwave gaas mmics the die should be attached directly to the ground plane eutectically or with conductive epoxy (see hmc general handling, mounting, bonding note). 50 ohm microstrip transmission lines on 0.127mm (5 mil) thick alumina thin flm substrates are recommended for bringing rf to and from the chip (figure 1). if 0.254mm (10 mil) thick alumina thin flm substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the surface of the substrate. one way to accom - plish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (figure 2). microstrip substrates should be located as close to the die as possible in order to minimize bond wire length. typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). handling precautions follow these precautions to avoid permanent damage. storage: all bare die are placed in either waffle or gel based esd pro - tective containers, and then sealed in an esd protective bag for shipment. once the sealed esd protective bag has been opened, all die should be stored in a dry nitrogen environment. cleanliness: handle the chips in a clean environment. do not attempt to clean the chip using liquid cleaning systems. static sensitivity: follow esd precautions to protect against > 150v esd strikes. transients: suppress instrument and bias supply transients while bias is applied. use shielded signal and bias cables to minimize inductive pick-up. general handling: handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. the surface of the chip may have fragile air bridges and should not be touched with vacuum collet, tweezers, or fngers. mounting the chip is back-metallized and can be die mounted with ausn eutectic preforms or with electrically conductive epoxy. the mounting surface should be clean and fat. eutectic die attach: a 80/20 gold tin preform is recommended with a work surface temperature of 255 c and a tool temperature of 265 c. when hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 c. do not expose the chip to a temperature greater than 320 c for more than 20 seconds. no more than 3 seconds of scrubbing should be required for attachment. epoxy die attach: apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fllet is observed around the perimeter of the chip once it is placed into position. cure epoxy per the manufacturers schedule. wire bonding ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. thermosonic wirebonding with a nominal stage temperature of 150 c and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is rec - ommended. use the minimum level of ultrasonic energy to achieve reliable wirebonds. wirebonds should be started on the chip and terminated on the package or substrate. all bonds should be as short as possible <0.31mm (12 mils). for price, delivery and to place orders: hittite microwave corporation, 2 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com information furn is hed by an al og devices is believed to be a cc urate and re lia bl e. however, no responsibility is assumed by an al og devices for its u se, no r for any infring emen ts of pat en ts or other rights of third parties that may result from its use. specifications subject to change without notice. no license is granted by implication or otherwise under any patent or patent rights of analog devices. trademarks and registered trademarks are the property of their respective owners. for price, delivery, and to place o rd ers: an al og devices, inc., one techn ol ogy way, p.o. box 9106, norwood, ma 02062-9106 phone: 781-329-4700 o rd er online at ww w.an alog .com app li cation sup po rt: p ho ne: 1-800-analog-d
frequency multiplier - active - chip 8 HMC1110 v00.0615 ga a s mmic x6 active frequency multiplier, 71 - 86 ghz notes for price, delivery and to place orders: hittite microwave corporation, 2 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com information furn is hed by an al og devices is believed to be a cc urate and re lia bl e. however, no responsibility is assumed by an al og devices for its u se, no r for any infring emen ts of pat en ts or other rights of third parties that may result from its use. specifications subject to change without notice. no license is granted by implication or otherwise under any patent or patent rights of analog devices. trademarks and registered trademarks are the property of their respective owners. for price, delivery, and to place o rd ers: an al og devices, inc., one techn ol ogy way, p.o. box 9106, norwood, ma 02062-9106 phone: 781-329-4700 o rd er online at ww w.an alog .com app li cation sup po rt: p ho ne: 1-800-analog-d
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